CAPABILITY AND EQUIPMENT LISTING
The Wytan Company occupies a 9000 square foot manufacturing facility at the Coors Technology Center in Golden, CO. The facility consists of 2500 square feet of office space for corporate, design, engineering, and administration functions, 5000 square feet of semi-clean room manufacturing space, and 1500 square feet of stockroom and misc. assembly space.
Manufacturing capabilities include equipment for both advanced surface mount and advanced technology assembly processing and test for prototype, mid volume, and high volume requirements. Capacity in place handles prototype through high volume production processing in excess of 35,000 components per hour.
Equipment includes:
| Description | Function |
| High Volume Surface Mount | |
| Fuji GSP 3 | In line, vision controlled automated stencil printer |
| Fuji GL 2 | In line, vision controlled adhesive/epoxy dispenser |
| Fuji CP3 | In line high speed chip shooter with capacity for 140 feeders, vision controlled |
| Fuji IP 1 | In line flex mounter with fine pitch capability to .019", matrix tray capability |
| Fuji MCS 30 | Integrated computer control system |
| Fuji DT 2 | Programming digitizer and comparator |
| Heller 1800 W | In line, 12 zone computerized convection reflow oven with self profiling capability |
| Electrovert Aquastorm 200 | In line, multi stage aqueous cleaning system with DI capability |
| Mid Volume Surface Mount | |
| SM Techniques SL 2220 | Semi automatic stencil printer with machine vision alignment |
| Juki/Zevatech FM-760 | Advanced component placement system with full machine vision, places all smt and die components 0201 and up, .010" on center |
| Juki/Zevatech FS-730 | Flexshooter component placement system, places all smt parts 0402 up to QFP fine pitch to .015" on center |
| Vitronics SMD-300 | In line, 8 zone infra red, convection solder reflow oven |
| ECB 6300-B | Batch aqueous cleaner |
| Prototype Surface Mount | |
| MPM SP-1500 | Semi automatic stencil printer |
| SM Techniques 1414-PD | Opti print semi automatic stencil printer |
| SM Techniques 5100 | Stencil Printer |
| Juki/Zevatech FS-730 | Flexshooter component placement system, places all parts 0402 up to QFP fine pitch to .015" on center |
| Advanced Technology Processing | |
| Asymtek 104 | Programmable computer controlled dispensing system with machine vision |
| Yield Engrg YES PE-1000 | Plasma Clean System with Vacuum Chamber |
| K&S 1419 | Programmable, semi-automatic GoldWire Ball Bonder |
| Micromanipulator 600 | Probe Station |
| Terra Universal | Wire bond pull tester |
| Imada DPS-4R | BGA ball shear tester |
| Fenwell 400 | -40 degree Freezer |
| Blue-M POM 500 | Programmable batch cure oven |
| Branson 3510 | Ultrasonic batch cleaner |
| Inspection/Verification | |
| Glenbrook ML 80 | Xray system for inspection of BGA |
| Cyber Optics 204 | Cyber Scan laser profiler and inspection system, non contact measurement of critical BGA heights |
| Vision Engrg Mantis | Inspection microscope |
| Nikon SMZ-1B (6) | Inspection stereo microscopes |
| Foster FO-150 (3) | Inspection stereo microscopes |
| Through Hole Processing | |
| Treiber 700B-16F | Wave Solder machine, 16" max width, palletless finger conveyor, multi stage pre heat |
| Electrovert H-500 | In line aqueous cleaning system |
| Hakko 485 | Solder fountain |
| Hepco 1500-1 (2) | Lead former |
| Steckfuss AO751C | IC lead former |
| Hepco 7600 (2) | IC lead former |
| Hepco 3000-2 | Lead former |
| GPD CF8 | Lead former |
| GPD TF-5300 | Lead cutter |
| Fancort FA-1680 | Lead cutter |
| Fancort FA-2970 | Lead cutter |
| Rework | |
| Ungar SMR-1000 | Hot gas surface mount / BGA rework |
| Pace PPS75A | Solder rework station |
| Misc. Equipment | |
| Nordson | Conformal coat spray system |
| Conform Industries | Conformal coat dip system |
| Vtek | Tape and Reel part insertion system |
| Vtek | Tape and Reel counter |
| Wesksler | Temperature and Humidity monitoring system |
This document maintained by {David
McDonald}.
Material Copyright © 2000 Last updated 10/28/06